דרושים בטבריה והכנרת- משרות פנויות: מהנדס אלקטרוניקה וחשמל

We are looking for an experienced and diligent individual to join the team.What will you be doing:
Taking part in the development of the company’s flagship products
Responsibility for the development from the design stage to the final product, including all tests necessary to deliver the product to mass production (electronic tests, thermal tests, EMI tests…)
Working with other teams inside the Hardware division and outside of it (such as the Mechanical department, Software and more)

B.Sc. in Electrical engineering
-At least 1 year experience in power electronics
-Knowledge in Analog circuits and Op Amps behavior - Must.
-Experience of designing Flyback DC2DC converters
-Proven experience working with lab equipment such as Spectrum, Scope, Electronic Loads act

-Education: Technical Electricity degree / certificate (Technician,
Practical Engineer).
-Experience in System Debug (Power, Analog, Digital).
-Experience in component level Debug (Power, Analog, Digital).
-Experience in work with basic test equipment (scopes, power meters…).

To Design Real time ’C’ code for POE Application, from Definition through Design, Documentation, Coding and Testing.
To Perform Code Debug, Failure analysis, Bugs Documentation, according to Real time embedded team methodologies .
To Design and develop Automatic and Manual Validation Tests using Python scripts. (Estimated about 30% job load).

BSc. Electrical Engineering (Advantage for GPA > 85)
1 - 3 Years of experience in C coding
Real Time Embedded Coding Experience
Hands On Experience in Hardware LAB Work - Advantage
Experience in PYTHON - Advantage

Wafer Technologies is a new disruptive start-up developing unique wireless communication systems for various applications, ranging from Cellular systems and products current and 5G, Wi-Fi access points and clients and all the way to high frequency systems such as SATCOM, Point to Point and Point to Multi-Point at the Micro-wave and millimeter wave range for Space and terrestrial systems.
As an Antenna Design Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique antennas and and RF front ends from 500MHz all the way to 90GHz enabling wireless connectivity to the Internet back-bone around the world in the most spectrally efficient and cost effective way possible.
We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

Minimum of BSc. In Electrical Engineering or equivalent with emphasis on electro-magnetic, Antennas, MW and wireless communication.
Minimum of 5 years hands on experience designing antennas, Passive micro-wave components and devices with direct experience in Micro-strip, strip line and printed technology.
Practical experience of steerable beam antennas and integration into low-cost and mass production products.
Design experience with HFSS and Ansys designer and or equivalent.
Experience using Matlab and writing scripts for complicated simulation models
Hands-on experience in testing antennas in Far Field and or Near Field Chambers;
Lab experience measuring S parameters and RF sub-systems;
Desired Skills:
Experience developing antennas into complete communication systems for either point to point and or point to multi-point, clear know how of communication theory and link budgets.
Clear Understanding of transmission line theory and distributed systems.
Experience launching sub-antenna systems into mass production.
Understanding of various manufacturing processes and technologies, such as die-cast, printed technologies, materials and integration.
Experience designing conformal Radom’s for low and high frequency products.
Understanding of the RF chain for transmits and receives systems.
Radar fundamentals knowledge is a plus.

Direct Mechanical design experience with Solid-works or equivalent.
Minimum of 5 years hands on experience supporting mechanical design for antennas, electronic packaging, mounting equipment, Radom’s, positioners for accurate pointing systems and conformal structures;
Direct Experience for sheet metal design, design for Die-cast and Injection Molding as well as 3D printers and unique printing technologies.
Hands-on experience assembling and integrating electronic systems, RF radios and Antenna systems into a mechanical packing for test set-ups and complete products.
Hands-on experience for stress analysis and thermal analysis for Radio systems.
Experience designing mechanical packaging and or Mechanical design of antennas into complete communication systems for either point to point and or point to multi-point.
In depth experience of thermal distribution and design for power dissipation.
Understanding of various manufacturing processes and technologies, such as die-cast, printed technologies, materials and integration, sheet metal design and manufacturing, stamping, semiconductor manufacturing process such as LCD’s, wafers etc.
Experience designing conformal Radom’s for low and high frequency products.
Mass production experience and design experience in the semi-conductor industry is a plus.

Wafer is a new disruptive start-up developing unique wireless communication systems for various applications, ranging from Cellular systems and products current and 5G, Wi-Fi access points and clients and all the way to high frequency systems such as SATCOM, Point to Point and Point to Multi-Point at the Micro-wave and millimeter wave range for Space and terrestrial systems.
As a Mixed/Signal Hardware Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deployable wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes and you would need to provide innovative solutions from a an Mixed signal design perspective, including digital/analog board design, drivers, RF feeding network and control circuitry, DAC, ADC, and RF chains control.
We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

1. BSc in Electrical Engineering.
2. 5+ years of hands on experience as Mixed Signal Design Engineer.
3. Understanding of architecture considerations, including Analog distribution signal for RF components and transceivers.
4. HDL (VHDL/Verilog) experience a plus
5. Strong background in FPGA design and FPGA selection.
6. Board design experience and leading into mass production a big plus.
7. Experience integrating Radio systems, and RF board design for various components level
8. Some transmission line theory knowledge and MW design of passive parts associated with large Radio system chains is a plus.
9. Layout Experience for Mixed signal and signal integrity big plus.

• Lead a group of debug technician
• Lead electronic failure analysis processes for company's products
• Determine root cause for failures under investigation and determine corrective actions with the production team.

• Education: B.Sc. in electrical engineering

• At least 5 years of experience in one or more relevant fields: 

• Power electronics, DC-DC/DC-AC converters or analog circuits 

• Board design 

• Electronic failure analysis
• Lab equipment and test

•Business planning: Develop a forward-looking business strategy and product plan which defines market trends, technology and ecosystem shifts, opportunities and risks and a specific plan for market development. Provide the company with a sense of direction
•Marketing and competitive research
•Product definition: Define, via profound understanding of customers’ needs and environments, the specific sets of features required to deliver new products with a competitive advantage. Manage the product configuration throughout the life time of the product.

•Engineering/Scientific degree (preferably Electronic/SW Engineering), MBA
•3 years of product marketing responsibility for high tech product line (HW & SW based integrated system) – from product strategy to technological core competence.
•Equally skilled in technological, business and product management and marketing aspects of product life cycle
•Proved leadership skills, capable to lead cross-functional product team and a matrix-managed processes involving R&D, operations, marketing and sales
•Strong analytical skills & capability to identify business opportunities and devise product strategies/plans accordingly
•Excellent communication skills, eloquent in Hebrew and English both oral and written

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